Tag: Lakefield
Intel Lakefield chips to power foldable, dual screen PCs of the future
Chip giant Intel has launched new Hybrid Processors codenamed Lakefield for next-gen PCs that would power foldable and dual screen devices of the future....
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Ingram Micro’s Strategic Vision: Diego Utge and N.S. Bindra Discuss Innovation, Customer Centricity, and...
In an exclusive conversation with Diego Utge, EVP and Group President – APAC, Ingram Micro, and N.S. Bindra, SVP and Chief Country Executive, Ingram...
Genesys celebrates partner success at the 2022 APAC Partner Conference
Genesys recognised its partners with several partnership excellence awards during the 2022 APAC Virtual Partner Conference for their proven success in advancing and elevating...
Park Place Technologies appoints David Cramer as President of Software, Managed and Professional Services
David Cramer has been named President of the Park Place Technologies Software, Managed and Professional Services Strategic Business Unit. In this newly created role,...